Microsystem integration from RF to millimeter wave applications

T. Vähä-Heikkilä; M. Lahti

doi:10.1117/12.2180864

15 June 2015 Microsystem integration from RF to millimeter wave applications

T. Vähä-Heikkilä, M. Lahti

Proceedings Volume 9517, Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems; 95170R (2015) https://doi.org/10.1117/12.2180864
Event: SPIE Microtechnologies, 2015, Barcelona, Spain

Abstract

Radio frequency systems have been applied successfully to consumer products. Typically these radios operate up to 6 GHz. During recent years, interest towards microwave (up to 30 GHz) and millimeter wave frequencies (30 ... 300 GHz) has increased significantly. Technologies have been developed to have high performance microwave and millimeter wave components. On the other hand, integration and packaging technologies have not developed as fast while their importance is crucial especially in consumer applications. This presentation focuses to latest trends in wireless microsystem component integration and packaging trends backed up with demonstrators and measured results based on VTT’s demonstrations.

Citation Download Citation

T. Vähä-Heikkilä and M. Lahti "Microsystem integration from RF to millimeter wave applications", Proc. SPIE 9517, Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems, 95170R (15 June 2015); https://doi.org/10.1117/12.2180864

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