Pulse separation times within the burst from 1 ps to 8 ps result in deeper holes with a larger silhouette area, however equal or reduced hole quality and reproducibility compared to drilling with individual pulses. In contrast with pulse separation times from 510 ps to 4 ns a quality and reproducibility improvement is visible. For these delay times the achieved depth was equal or higher compared to micromachining without bursts. |
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CITATIONS
Cited by 5 scholarly publications.
Picosecond phenomena
Laser drilling
Silicon
Shape analysis
Ultrafast phenomena
Crystals
Imaging systems