Electrostatic risks to reticles and damage prevention methodology

Gavin C. Rider

doi:10.1117/12.2218360

8 March 2016 Electrostatic risks to reticles and damage prevention methodology

Gavin C. Rider

Proceedings Volume 9778, Metrology, Inspection, and Process Control for Microlithography XXX; 97782S (2016) https://doi.org/10.1117/12.2218360
Event: SPIE Advanced Lithography, 2016, San Jose, California, United States

Abstract

In recent years a great deal of effort has been expended to try and reduce the reticle ESD damage problem. Methods are almost all based on the standard principles developed for the protection of ESD sensitive electronic devices – but reticles are not the same as electronic devices. Reticles are predominantly damaged by electric field rather than the conductive transfer of static charge, and the physical mechanisms that damage reticles are different from those that damage electronic devices. This paper explains why some of the established methods for ESD prevention are not the best way to protect reticles and in some cases actually increase the risk of reticle damage. Measurements are presented showing that, contrary to the widely held opinion and current practice in semiconductor manufacturing, static dissipative plastic is not the best material to use for the construction of reticle pods. An appropriate combination of insulating material and metallic shielding is shown to provide the best electrostatic protection for reticles.

Citation Download Citation

Gavin C. Rider "Electrostatic risks to reticles and damage prevention methodology", Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 97782S (8 March 2016); https://doi.org/10.1117/12.2218360

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KEYWORDS

Reticles

Semiconductors

Electronic components

Sensors

Ionization

Electric field sensors

Glasses

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