Line edge roughness frequency analysis for SAQP process

Lei Sun; Xiaoxiao Zhang; Shimon Levi; Adam Ge; Hua Zhou; Wenhui Wang; Navaneetha Krishnan; Yulu Chen; Erik Verduijn; Ryoung-han Kim

doi:10.1117/12.2229176

15 March 2016 Line edge roughness frequency analysis for SAQP process

Lei Sun, Xiaoxiao Zhang, Shimon Levi, Adam Ge, Hua Zhou, Wenhui Wang, Navaneetha Krishnan, Yulu Chen, Erik Verduijn, Ryoung-han Kim

Author Affiliations +

Proceedings Volume 9780, Optical Microlithography XXIX; 97801S (2016) https://doi.org/10.1117/12.2229176
Event: SPIE Advanced Lithography, 2016, San Jose, California, United States

Abstract

The line edge roughness (LER) and line width roughness (LWR) transfer in a self-aligned quadruple patterning (SAQP) process is shown for the first time. Three LER characterization methods, including conventional standard deviation method, power spectral density (PSD) method and frequency domain 3-sigma method, are used in the analysis. The wiggling is also quantitatively characterized for each SAQP step with a wiggling factor. This work will benefit both process optimization and process monitoring.

Citation Download Citation

Lei Sun, Xiaoxiao Zhang, Shimon Levi, Adam Ge, Hua Zhou, Wenhui Wang, Navaneetha Krishnan, Yulu Chen, Erik Verduijn, and Ryoung-han Kim "Line edge roughness frequency analysis for SAQP process", Proc. SPIE 9780, Optical Microlithography XXIX, 97801S (15 March 2016); https://doi.org/10.1117/12.2229176

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