Presentation
21 March 2023 Narrow ridge III-nitride m-plane violet edge-emitting laser diodes with sidewall passivation using atomic layer deposition
Author Affiliations +
Abstract
In this work, the device performances of three laser architectures are examined. All the laser epitaxial structures are grown on freestanding m-plane GaN substrates by Metalorganic Chemical Vapor Deposition (MOCVD), with a peak emission wavelength of about 405 nm. The three laser device architectures are shallow-etch ridge design, which the ridges are defined by etching into the p-GaN layer and not through the active region, and the deep-etch ridge structure that etches through the active region with or without Atomic Layer Deposition (ALD) sidewall passivation. By utilizing ALD sidewall passivation, the optical and electrical characteristics show significant improvements than the other two device designs.
Conference Presentation
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Matthew S. Wong, Haojun Zhang, Emily S. Trageser, Ryan M. Anderson, James S. Speck, Shuji Nakamura, and Steven P. DenBaars "Narrow ridge III-nitride m-plane violet edge-emitting laser diodes with sidewall passivation using atomic layer deposition", Proc. SPIE PC12421, Gallium Nitride Materials and Devices XVIII, (21 March 2023); https://doi.org/10.1117/12.2646155
Advertisement
Advertisement
KEYWORDS
Atomic layer deposition

Semiconductor lasers

Etching

Laser development

Metalorganic chemical vapor deposition

Gallium nitride

Laser applications

RELATED CONTENT

InGaN GaN DFB laser diodes at 434 nm with deeply...
Proceedings of SPIE (February 26 2016)
Microfabrication techniques for semiconductor lasers
Proceedings of SPIE (March 01 1991)
Scribing of GaN wafer for white LED by water jet...
Proceedings of SPIE (June 21 2004)
SCH-SQW semiconductor lasers
Proceedings of SPIE (January 20 2005)

Back to Top