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30 April 2023 AIMS® EUV 3.0: ZEISS’ next generation EUV mask review tool
Sven Krannich, Renzo Capelli, Matthias Stecher, Marc Schneider, Stefan Mueller
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Proceedings Volume PC12494, Optical and EUV Nanolithography XXXVI; PC1249407 (2023) https://doi.org/10.1117/12.2658396
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States
Abstract
The AIMS® EUV system represents a unique piece of the EUV mask infrastructure for the qualification of the mask printing performance in the aerial image. To meet the industry requirements in the future, ZEISS started the development of a next generation EUV mask review tool, the AIMS® EUV 3.0. The system is based on the best-in-class optical concept proven for the current generation. The tool will support 0.33NA isomorphic and 0.55NA anamorphic imaging from the beginning. In this paper, we will introduce the concept of the AIMS® EUV 3.0 and present the current development status.
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Sven Krannich, Renzo Capelli, Matthias Stecher, Marc Schneider, and Stefan Mueller "AIMS® EUV 3.0: ZEISS’ next generation EUV mask review tool", Proc. SPIE PC12494, Optical and EUV Nanolithography XXXVI, PC1249407 (30 April 2023); https://doi.org/10.1117/12.2658396
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KEYWORDS
Extreme ultraviolet
Extreme ultraviolet lithography
Imaging systems
Metrology
Scanners
Illumination engineering
Printing
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