In situ monitoring and controlling surface shape of the polishing pad in continuous polishing

Jin Yin; Xiang Jiao; Wenlong Tang; Jianqiang Zhu

doi:10.1117/1.OE.57.7.074103

14 July 2018 In situ monitoring and controlling surface shape of the polishing pad in continuous polishing

Jin Yin, Xiang Jiao, Wenlong Tang, Jianqiang Zhu

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Optical Engineering, Vol. 57, Issue 7, 074103 (July 2018). https://doi.org/10.1117/1.OE.57.7.074103

Abstract

High-power laser devices have stringent requirements for the surface accuracy of optical elements. Continuous polishing is an effective technique for polishing high-precision optical elements. To overcome the problem of poor real-time capability and low accuracy in traditional surface shape monitoring and controlling methods used in continuous polishing, an online monitoring device is developed to monitor the surface shape of the polishing pad. The experimental results of the online measurement are highly consistent with the offline results obtained using an interferometer. The correctness and feasibility of the online monitoring scheme are well validated. Based on the online monitoring device for the surface shape of the polishing pad, we propose a method of automatic control for the surface shape of the polishing pad. This method maintains the flatness of the polishing pad to 0.05λ (λ = 632.8 nm), peak to valley, as measured on a 100-mm monitoring element through computer control.

CC BY: © The Authors. Published by SPIE under a Creative Commons Attribution 4.0 Unported License. Distribution or reproduction of this work in whole or in part requires full attribution of the original publication, including its DOI.

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Jin Yin, Xiang Jiao, Wenlong Tang, and Jianqiang Zhu "In situ monitoring and controlling surface shape of the polishing pad in continuous polishing," Optical Engineering 57(7), 074103 (14 July 2018). https://doi.org/10.1117/1.OE.57.7.074103

Received: 14 March 2018; Accepted: 3 July 2018; Published: 14 July 2018

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