9 April 2020 Experimental investigation of the stress field around the crack tip in a polymer material under dynamic loading
Peng Xu, Renshu Yang, Yang Guo, Cheng Chen, Zhicheng Guo
Author Affiliations +
Abstract

A dynamic photoelasticity-caustic experimental system is established to quantitatively visualize and characterize the distribution of an entire stress field. The evolution of both the singular stress and far-field stress around the crack tip can be precisely determined using the proposed multiparameter solution. Moreover, the accuracy of the proposed stress inverse calculation method increased with an increasing number of parameters. The reconstructed isochromatic fringes based on 12-parameter solutions agreed well with the results obtained by the photoelasticity technique. Moreover, the influence of the parameters on the crack propagation behaviors was comprehensively investigated. In addition, the numerical results showed that the 12-parameter solution was sufficient for modeling the stress field around the crack tip, which enlarged the estimation region by at least 50 times compared with that of the traditional three-parameter (KId, KIId, and T-stress) solution.

© 2020 Society of Photo-Optical Instrumentation Engineers (SPIE) 0091-3286/2020/$28.00 © 2020 SPIE
Peng Xu, Renshu Yang, Yang Guo, Cheng Chen, and Zhicheng Guo "Experimental investigation of the stress field around the crack tip in a polymer material under dynamic loading," Optical Engineering 59(4), 044105 (9 April 2020). https://doi.org/10.1117/1.OE.59.4.044105
Received: 12 March 2020; Accepted: 30 March 2020; Published: 9 April 2020
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CITATIONS
Cited by 3 scholarly publications.
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KEYWORDS
Photoelasticity

Polymers

Optical engineering

High speed cameras

Epoxies

Finite element methods

Pulsed laser operation

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