Proceedings Article | 30 May 2003
Frederic Laune, Herve Poujard, Christophe Roux, Stephane Bernabe, Pascal Despinasse, Vincent Larrey, Emmanuel Grassin d'Alphonse, Mickael Miglietti, Luc Kaes
KEYWORDS: Adhesives, Reliability, Epoxies, Resistance, Polishing, Glasses, Silicon, Optical components, Ultraviolet radiation, Packaging
The packaging of optical components (splitters, WDM, VOA, switches) used in telecommunication applications uses very often Fiber Arrays: it is indeed a very practical component to connect high channel count components (from 1 to 48 channels typically) to the outside world. These Fiber Arrays can be in different formats: standard, focusing, collimating, with single mode fiber or polarization maintaining fiber.
But the optical performance of the packaged component is primarily linked to the performance of the Fiber Array. Also, the reliability of the packaged component is mainly determined by the reliability of the Fiber Array, and the way it is attached to the component.
The optical performance includes mainly the fiber position error (Core Offset), which determines the insertion loss, but also the polishing induced parameters: polishing angles, surface planarity, fiber protrusion. Optical parameters are also important: excess loss, PDL, and return loss.
During the presentation will be related some measurement options, and some results.
The reliability of the fiber array is also very important, in order to meet the Telcordia qualification on the packaged product. Unfortunately, these standards, which apply to the packaged component, does not describe qualification procedures for Fiber Arrays, leaving some uncertainty on how to assess the reliability of the product. Different qualification options will be discussed, and some Telcordia qualification results shown.
