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3D and nanoscale dimensions make patterning extremely difficult to perform. In the past, patterning via plasma etching was a success thanks to the very good capacity of this process to etch one preferential material over the others: selective etching. Next step for advanced patterning will be to add a selective deposition step in addition to the etch one. Good examples are area selective deposition and topographical selective deposition. They will be discuss in this presentation
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christophe vallee, Marceline Bonvalot, Taguhi Yeghoyan, Moustapha Jaffal, Nicolas Posseme, Remy Gassilloud, Thierry Chevolleau, "Selective patterning using deposition and etch: case of area selective deposition," Proc. SPIE 11615, Advanced Etch Technology and Process Integration for Nanopatterning X, 116150C (22 February 2021); https://doi.org/10.1117/12.2582079