Machine vision system for alignment in die-to-wafer bonder

Jiyoung Chu; Minhwan Seo; Hyungjin Kim; Wondon Joo; Sungmin Ahn; Sangwoo Bae

doi:10.1117/12.2633000

3 October 2022 Machine vision system for alignment in die-to-wafer bonder

Jiyoung Chu, Minhwan Seo, Hyungjin Kim, Wondon Joo, Sungmin Ahn, Sangwoo Bae

Proceedings Volume 12222, Optical System Alignment, Tolerancing, and Verification XIV; 122220L (2022) https://doi.org/10.1117/12.2633000
Event: SPIE Optical Engineering + Applications, 2022, San Diego, California, United States

Conference Poster

Abstract

In this paper, we suggested an alignment mark measurement system for die-to-wafer bonder. The system consisted of a vision system to measure the positions of alignment marks on die and wafer opposite to each other, and a height measurement system to detect the heights of the die and wafer to the vision system. Besides them, a tilt measurement system was also attached to check the parallelism between the die and wafer for exact measurement and bonding. For high precision measurement, the vision system used a special prism structure which minimized the distance between the die and wafer and measured alignment marks on both sides simultaneously. A focus tunable lens was also applied to control a focus position without changing the height of the system. We have designed and built the optical system in a compact size and presented some preliminary results here.

Citation Download Citation

Jiyoung Chu, Minhwan Seo, Hyungjin Kim, Wondon Joo, Sungmin Ahn, and Sangwoo Bae "Machine vision system for alignment in die-to-wafer bonder", Proc. SPIE 12222, Optical System Alignment, Tolerancing, and Verification XIV, 122220L (3 October 2022); https://doi.org/10.1117/12.2633000

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