Paper
17 August 2023 Thick-mask optimization based on particle swarm optimization algorithm
Author Affiliations +
Proceedings Volume 12757, 3rd International Conference on Laser, Optics, and Optoelectronic Technology (LOPET 2023); 127570C (2023) https://doi.org/10.1117/12.2690171
Event: 3rd International Conference on Laser, Optics and Optoelectronic Technology (LOPET 2023), 2023, Kunming, China
Abstract
Extreme ultraviolet lithography (EUV) is a key technology for micro-nano processing and is widely used in the chip manufacturing process. Mask optimization is one of the key resolution enhancement techniques in EUV lithography. In this paper, a thick mask optimization method based on particle swarm optimization (PSO) algorithm is proposed to improve simulation accuracy and imaging quality. In this work, we change the calculation order of formulas, which is used to accelerate the imaging calculations. The equivalent film layer method is used to approximate the reflection coefficients of thick mask multilayer film structures to improve the simulation accuracy. The inverse lithography problem for thick mask optimization is solved by particle swarm optimization algorithm. The simulation results show that this method can effectively improve the simulation accuracy and imaging quality.
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jinwei Pan, Shuang Xu, and Xianhao Peng "Thick-mask optimization based on particle swarm optimization algorithm", Proc. SPIE 12757, 3rd International Conference on Laser, Optics, and Optoelectronic Technology (LOPET 2023), 127570C (17 August 2023); https://doi.org/10.1117/12.2690171
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KEYWORDS
Particle swarm optimization

Source mask optimization

Extreme ultraviolet lithography

Particles

Film thickness

3D mask effects

3D modeling

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