Presentation + Paper
9 April 2024 Maskless exposure of die annotations and image sensor patterns employing 7th generation RGB resists
K. Varga, M. Weinhart, R. Holly, T. Zenger, B. Považay, F. Bögelsack, A. Spitzer, T. Uhrmann, H. Takishita, Y. Taguchi, J. Koch, M. Schicke
Author Affiliations +
Abstract
High–volume–capable Maskless Exposure technology is demonstrated to deliver fast and individualized production abilities for micro-optical applications, individual device labelling and micro–structuring of novel RGB–colored photoresists at the die level. Dynamic alignment enables real–time distortion compensation and adaptive repositioning of sub 2μm structures during write–time enabling novel possibilities for heterogenous integration and associated applications.
Conference Presentation
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
K. Varga, M. Weinhart, R. Holly, T. Zenger, B. Považay, F. Bögelsack, A. Spitzer, T. Uhrmann, H. Takishita, Y. Taguchi, J. Koch, and M. Schicke "Maskless exposure of die annotations and image sensor patterns employing 7th generation RGB resists", Proc. SPIE 12956, Novel Patterning Technologies 2024, 129560B (9 April 2024); https://doi.org/10.1117/12.3010156
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KEYWORDS
Optical lithography

Semiconducting wafers

Distortion

Image sensors

Optical alignment

RGB color model

Matrices

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