Transmission line with flip-chip structure for high-frequency connection in optoelectronic chips

Keqi Cao; Xinyan Zhang; Wei Lin; Jia Chen; Hang Yu; Xiaonan Chen; Kunpeng Zhai; JinHua Bai; Haiqing Yuan; Ninghua Zhu; Ming Li; Yu Liu

doi:10.1117/12.3035011

8 November 2024 Transmission line with flip-chip structure for high-frequency connection in optoelectronic chips

Keqi Cao, Xinyan Zhang, Wei Lin, Jia Chen, Hang Yu, Xiaonan Chen, Kunpeng Zhai, JinHua Bai, Haiqing Yuan, Ninghua Zhu, Ming Li, Yu Liu

Author Affiliations +

Proceedings Volume 13233, Semiconductor Lasers and Applications XIV; 132330X (2024) https://doi.org/10.1117/12.3035011
Event: SPIE/COS Photonics Asia, 2024, Nantong, Jiangsu, China

Conference Poster

Abstract

In this paper, we propose a structure for flip-chip bonding of the transmission line chip, enabling the connection of high-speed optoelectronic chips with other high-speed chips or RF connectors. The simulation results demonstrate that this structure could achieve excellent RF transmission performance and high process tolerance within the range of 10 MHz to 67 GHz.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Keqi Cao, Xinyan Zhang, Wei Lin, Jia Chen, Hang Yu, Xiaonan Chen, Kunpeng Zhai, JinHua Bai, Haiqing Yuan, Ninghua Zhu, Ming Li, and Yu Liu "Transmission line with flip-chip structure for high-frequency connection in optoelectronic chips", Proc. SPIE 13233, Semiconductor Lasers and Applications XIV, 132330X (8 November 2024); https://doi.org/10.1117/12.3035011

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