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9 May 1997 Structuring of dielectric and metallic materials with ultrashort laser pulses between 20 fs and 3 ps
Joerg Krueger, Wolfgang Kautek, Matthias Lenzner, Sasa Sartania, Christian Spielmann, Ferenc Krausz
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Proceedings Volume 2991, Laser Applications in Microelectronic and Optoelectronic Manufacturing II; (1997) https://doi.org/10.1117/12.273740
Event: Photonics West '97, 1997, San Jose, CA, United States
Abstract
Laser-micromachining of barium aluminum borosilicate glass, fused silica and stainless steel has been extended down to a pulse duration of 20 fs generated by a Ti:sapphire laser system at a wavelength of 0.8 micrometer. A systematic study shows that, below 100 fs, an enhanced precision and a substantial decrease of the ablation threshold fluence in comparison to pulse laser processing with pulses in the picosecond and nanosecond range could be achieved. The physical mechanism and the technical relevance of this novel microtechnology is discussed.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
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Joerg Krueger, Wolfgang Kautek, Matthias Lenzner, Sasa Sartania, Christian Spielmann, and Ferenc Krausz "Structuring of dielectric and metallic materials with ultrashort laser pulses between 20 fs and 3 ps", Proc. SPIE 2991, Laser Applications in Microelectronic and Optoelectronic Manufacturing II, (9 May 1997); https://doi.org/10.1117/12.273740
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KEYWORDS
Laser ablation
Pulsed laser operation
Aluminum
Barium
Borosilicate glass
Silica
Glasses
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