Photolithography on micromachined 3D surfaces using spray coating technology of photoresist

Arief Suriadi; Thomas Luxbacher

doi:10.1117/12.425213

26 April 2001 Photolithography on micromachined 3D surfaces using spray coating technology of photoresist

Arief Suriadi, Thomas Luxbacher

Proceedings Volume 4404, Lithography for Semiconductor Manufacturing II; (2001) https://doi.org/10.1117/12.425213
Event: Microelectronic and MEMS Technologies, 2001, Edinburgh, United Kingdom

Abstract

A relatively little known form of photoresist coating for special applications of 3D structured wafer patterning by spray technology has been studied, specifically on the OnmiSpray coating technology developed by Electronics Vision Group Austria. Results of the present investigation confirm the superior uniformity of photoresist coating by spray technology on the high topography wafer structure compared to the conventional spin coating method, typically used on planar semiconductor wafer structure. Special attention is paid to the improvement of photoresist coverage on the convex corners of the 3D structure by rounding them off first in a TMAH solution. The integrated method offers an enabling technology for patterning of extensive topography typically required for a multitude of MEMS structures and designs, novel interconnect structures as well as advanced packaging applications. The method is simple, fast and low cost in comparison with other photoresist coating techniques available and capable of 3D structure patterning.

Citation Download Citation

Arief Suriadi and Thomas Luxbacher "Photolithography on micromachined 3D surfaces using spray coating technology of photoresist", Proc. SPIE 4404, Lithography for Semiconductor Manufacturing II, (26 April 2001); https://doi.org/10.1117/12.425213

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