Microvia formation with lasers

Yunlong Sun; Corey M. Dunsky; Hisashi Matsumoto; Glenn Simenson

doi:10.1117/12.482893

12 September 2002 Microvia formation with lasers

Yunlong Sun, Corey M. Dunsky, Hisashi Matsumoto, Glenn Simenson

Proceedings Volume 4915, Lasers in Material Processing and Manufacturing; (2002) https://doi.org/10.1117/12.482893
Event: Photonics Asia, 2002, Shanghai, China

Abstract

Laser drilling has emerged in the last five years as the most widely accepted method of creating microvias in high-density electronic interconnect and chip packaging devices. Most commercially available laser drilling tools are currently based on one of two laser types: far-IR CO2 lasers and UV solid-state lasers at 355 nm. While CO2 lasers are recognized for their high average power and drilling throughput, UV lasers are known for high precision material removal and their ability to drill the smallest vias, with diameters down to about 25 –30 micron now achievable in production. This paper presents an overview of techniques for drilling microvias with the lasers.

Citation Download Citation

Yunlong Sun, Corey M. Dunsky, Hisashi Matsumoto, and Glenn Simenson "Microvia formation with lasers", Proc. SPIE 4915, Lasers in Material Processing and Manufacturing, (12 September 2002); https://doi.org/10.1117/12.482893

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