Paper
3 April 2003 Low cost, small form factor, and integration as the key features for the optical component industry takeoff
Author Affiliations +
Abstract
In the past the optical component market has been mainly driven by performances. Today, as the number of competitors has drastically increased, the system integrators have a wide range of possible suppliers and solutions giving them the possibility to be more focused on cost and also on footprint reduction. So, if performances are still essential, low cost and Small Form Factor issues are becoming more and more crucial in selecting components. Another evolution in the market is the current request of the optical system companies to simplify the supply chain in order to reduce the assembling and testing steps at system level. This corresponds to a growing demand in providing subassemblies, modules or hybrid integrated components: that means also Integration will be an issue in which all the optical component companies will compete to gain market shares. As we can see looking several examples offered by electronic market, to combine low cost and SFF is a very challenging task but Integration can help in achieving both features. In this work we present how these issues could be approached giving examples of some advanced solutions applied to LiNbO3 modulators. In particular we describe the progress made on automation, new materials and low cost fabrication methods for the parts. We also introduce an approach in integrating optical and electrical functionality on LiNbO3 modulators including RF driver, bias control loop, attenuator and photodiode integrated in a single device.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Francesco Schiattone, Stefano Bonino, Luigi Gobbi, Angelamaria Groppi, Marco Marazzi, and Maurizio Musio "Low cost, small form factor, and integration as the key features for the optical component industry takeoff", Proc. SPIE 4944, Integrated Optical Devices: Fabrication and Testing, (3 April 2003); https://doi.org/10.1117/12.472817
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KEYWORDS
Modulators

Semiconducting wafers

Packaging

Optical alignment

Optical components

Transponders

Photodiodes

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