Paper
24 April 2003 Adhesive wafer bonding for MEMS applications
Viorel Dragoi, Thomas Glinsner, Gerald Mittendorfer, Bernhard Wieder, Paul Lindner
Author Affiliations +
Proceedings Volume 5116, Smart Sensors, Actuators, and MEMS; (2003) https://doi.org/10.1117/12.499077
Event: Microtechnologies for the New Millennium 2003, 2003, Maspalomas, Gran Canaria, Canary Islands, Spain
Abstract
Low temperature wafer bonding is a powerful technique for MEMS/MOEMS devices fabrication and packaging. Among the low temperature processes adhesive bonding focuses a high technological interest. Adhesive wafer bonding is a bonding approach using an intermediate layer for bonding (e.g. glass, polymers, resists, polyimides). The main advantages of this method are: surface planarization, encapsulation of structures on the wafer surface, particle compensation and decrease of annealing temperature after bonding. This paper presents results on adhesive bonding using spin-on glass and Benzocyclobutene (BCB) from Dow Chemicals. The advantages of using adhesive bonding for MEMS applications will be illustrated be presenting a technology of fabricating GaAs-on-Si substrates (up to 150 mm diameter) and results on BCB bonding of Si wafers (200 mm diameter).
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Viorel Dragoi, Thomas Glinsner, Gerald Mittendorfer, Bernhard Wieder, and Paul Lindner "Adhesive wafer bonding for MEMS applications", Proc. SPIE 5116, Smart Sensors, Actuators, and MEMS, (24 April 2003); https://doi.org/10.1117/12.499077
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CITATIONS
Cited by 51 scholarly publications and 1 patent.
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KEYWORDS
Semiconducting wafers

Wafer bonding

Silicon

Annealing

Coating

Adhesives

Interfaces

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