Beginning-to-end wafer bonding for advanced optical systems

Shari N Farrens; Paul Lindner; Steven Dwyer; Markus Wimplinger

doi:10.1117/12.507179

10 November 2003 Beginning-to-end wafer bonding for advanced optical systems

Shari N Farrens, Paul Lindner, Steven Dwyer, Markus Wimplinger

Proceedings Volume 5177, Gradient Index, Miniature, and Diffractive Optical Systems III; (2003) https://doi.org/10.1117/12.507179
Event: Optical Science and Technology, SPIE's 48th Annual Meeting, 2003, San Diego, California, United States

Abstract

The old adage "Work Smarter, Not Harder" is certainly applicable in today's competitive marketplace for Optical MEMS. In order to survive the current economic conditions, high volume manufacturers must get optimum performance and yield from each design and manufactured component. Wafer bonding, and its numerous variants, is entering mainstream production environments by providing solutions throughout the production flow. For example, SOI (silicon on insulator) and other laminated materials such as GaAs/Si are used as cost effective alternatives to molecular epitaxy methods for Bragg mirrors, rf resonators, and hybrid device fabrication. Temporary wafer bonding is used extensively to allow fragile compound semiconductors to be attached to rigid support wafers. This allows for front side and backside processing with a reduction in wafer breakage and increases in thickness uniformity results after backgrind operations. Permanent wafer bonding is used to attach compound semiconductors to each other or silicon to completely integrate optical components and logic or MEMS components. Permanent hermetic sealing is used for waveguide formation and, when combined with vacuum sealing, higher performance is achieved for RF resonators. Finally, many of the low temperature solders and eutectic alloys are finding application in low temperature wafer-to-wafer level packaging of optical devices to ceramic packages. Through clever application of these bonding methods, throughput increases and reduction in fabrication complexity givs a clear edge in the market place. This presentation will provide guidelines and process overviews needed to adopt wafer-to-wafer bonding technologies into the high volume-manufacturing environment.

Citation Download Citation

Shari N Farrens, Paul Lindner, Steven Dwyer, and Markus Wimplinger "Beginning-to-end wafer bonding for advanced optical systems", Proc. SPIE 5177, Gradient Index, Miniature, and Diffractive Optical Systems III, (10 November 2003); https://doi.org/10.1117/12.507179

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available