MEMS as low-cost high-volume semiconductor solutions: it's all in the packaging and assembly

Joe Brown; Markus Lutz; Aaron Partridge; Pavan Gupta; Eric Radza

doi:10.1117/12.778250

19 February 2008 MEMS as low-cost high-volume semiconductor solutions: it's all in the packaging and assembly

Joe Brown, Markus Lutz, Aaron Partridge, Pavan Gupta, Eric Radza

Author Affiliations +

Proceedings Volume 6884, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII; 68840K (2008) https://doi.org/10.1117/12.778250
Event: MOEMS-MEMS 2008 Micro and Nanofabrication, 2008, San Jose, California, United States

Abstract

Micro-electromechanical (MEMS) oscillators are now in production and shipping in quantity. Early development of micro mechanical devices provided the understanding that metal beams could be fabricated and they would resonate as a time reference. The issues of performance and price have prevented silicon entry into the quartz dominated market until recent developments in semiconductor processing and assembly. Today MEMS oscillators are the world's smallest programmable precision oscillators and are displacing quartz technology in the +/- 50 ppm accuracy spec. New oscillators extend the technology with spread spectrum, voltage control, and improved jitter performance. New ultra-thin packaging, made possible by the small encapsulated MEMS resonators, provides the word's thinnest precision oscillators.

Citation Download Citation

Joe Brown, Markus Lutz, Aaron Partridge, Pavan Gupta, and Eric Radza "MEMS as low-cost high-volume semiconductor solutions: it's all in the packaging and assembly", Proc. SPIE 6884, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII, 68840K (19 February 2008); https://doi.org/10.1117/12.778250

Access the abstract

PROCEEDINGS
6 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY