Design and analysis of 3D stacked optoelectronics on optical printed circuit boards

John H. Lau; Ying Ying Lim; Teck Guan Lim; Gong Yue Tang; Chee Houe Khong; Xiaowu Zhang; Pamidighantam V. Ramana; Jing Zhang; Chee Wei Tan; Jayakrishnan Chandrappan; Joey Chai; Jing Li; Geri Tangdiongga; Dim Lee Kwong

doi:10.1117/12.764032

8 February 2008 Design and analysis of 3D stacked optoelectronics on optical printed circuit boards

John H. Lau, Ying Ying Lim, Teck Guan Lim, Gong Yue Tang, Chee Houe Khong, Xiaowu Zhang, Pamidighantam V. Ramana, Jing Zhang, Chee Wei Tan, Jayakrishnan Chandrappan, Joey Chai, Jing Li, Geri Tangdiongga, Dim Lee Kwong

Author Affiliations +

Proceedings Volume 6899, Photonics Packaging, Integration, and Interconnects VIII; 689907 (2008) https://doi.org/10.1117/12.764032
Event: Integrated Optoelectronic Devices 2008, 2008, San Jose, California, United States

Abstract

In this study, a low-cost (with bare chips) and high (optical, electrical, and thermal) performance optoelectronic system with a data rate of 10Gbps is designed and analyzed. This system consists of a rigid printed circuit board (PCB) made of FR4 material with an optical polymer waveguide, a vertical cavity surface emitted laser (VCSEL), a driver chip, a 16:1 serializer, a photo-diode detector, a Trans-Impedance Amplifier (TIA), a 1:16 deserializer, and heat spreaders. The bare VCSEL, driver chip, and serializer chip are stacked with wire bonds and then solder jointed on one end of the optical polymer waveguide on the PCB via Cu posts. Similarly, the bare photo-diode detector, TIA chip, and deserializer chip are stacked with wire bonds and then solder jointed on the other end of the waveguide on the PCB via Cu posts. Because the devices in the 3D stacking system are made with different materials, the stresses due to the thermal expansion mismatch among various parts of the system are determined.

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John H. Lau, Ying Ying Lim, Teck Guan Lim, Gong Yue Tang, Chee Houe Khong, Xiaowu Zhang, Pamidighantam V. Ramana, Jing Zhang, Chee Wei Tan, Jayakrishnan Chandrappan, Joey Chai, Jing Li, Geri Tangdiongga, and Dim Lee Kwong "Design and analysis of 3D stacked optoelectronics on optical printed circuit boards", Proc. SPIE 6899, Photonics Packaging, Integration, and Interconnects VIII, 689907 (8 February 2008); https://doi.org/10.1117/12.764032

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