9 September 2016 Ultraclean wafer-level vacuum-encapsulated silicon ring resonators for timing and frequency references
George Xereas, Vamsy P. Chodavarapu
Author Affiliations +
Abstract
We present the design and development of breath-mode silicon ring resonators fabricated using a commercial pure-play microfabrication process that provides ultraclean wafer-level vacuum-encapsulation. The micromechanical resonators are fabricated in MEMS integrated design for inertial sensors process that is developed by Teledyne DALSA Semiconductor Inc. The ring resonators are designed to operate with a relatively low DC polarization voltage, starting at 5 V, while providing a high frequency-quality factor product. We study the quality of the vacuum packaging using an automated testing setup over an extended time period. We study the effect of motional resistance on the performance of MEMS resonators. The fabricated devices had a resonant frequency of 10 MHz with the quality factor exceeding 8.4×104.
© 2016 Society of Photo-Optical Instrumentation Engineers (SPIE) 1932-5150/2016/$25.00 © 2016 SPIE
George Xereas and Vamsy P. Chodavarapu "Ultraclean wafer-level vacuum-encapsulated silicon ring resonators for timing and frequency references," Journal of Micro/Nanolithography, MEMS, and MOEMS 15(3), 035004 (9 September 2016). https://doi.org/10.1117/1.JMM.15.3.035004
Published: 9 September 2016
Lens.org Logo
CITATIONS
Cited by 4 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Resonators

Semiconducting wafers

Silicon

Microelectromechanical systems

Polarization

Wafer bonding

Etching

Back to Top