Current understanding of the electrostatic risk to reticles used in microelectronics and similar manufacturing processes

Gavin C. Rider

doi:10.1117/1.JMM.17.2.020901

27 April 2018 Current understanding of the electrostatic risk to reticles used in microelectronics and similar manufacturing processes

Gavin C. Rider

Author Affiliations +

Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 17, Issue 2, 020901 (April 2018). https://doi.org/10.1117/1.JMM.17.2.020901

Abstract

This paper explains how an electric field and a reticle interact and describes the different kinds of damage that can be caused to a reticle through its exposure to electric field. It is shown why electrostatic reticle damage has changed from ESD damage (which causes yield to suddenly drop precipitously) into a gradual and cumulative form of degradation that is very difficult to diagnose. It is explained why some of the approaches that have been taken to reduce ESD damage in the semiconductor factory, such as equipotential bonding and the use of static dissipative plastics for making reticle pods, actually increase the risk of this cumulative type of electrostatic degradation in reticles. When assessing the risk to reticles and designing an effective protective strategy for reticle handling, it is shown why one must take into account the temporal characteristics of a reticle’s interaction with electric field—including the effect that the reticle’s immediate surroundings will have on that interaction—as well as considering the strength of any electric field in the reticle handling environment. Solutions are presented that would allow the electrostatic risk to reticles to be reduced significantly, without requiring major changes to operating procedures in semiconductor manufacturing facilities.

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Gavin C. Rider "Current understanding of the electrostatic risk to reticles used in microelectronics and similar manufacturing processes," Journal of Micro/Nanolithography, MEMS, and MOEMS 17(2), 020901 (27 April 2018). https://doi.org/10.1117/1.JMM.17.2.020901

Received: 17 January 2018; Accepted: 27 March 2018; Published: 27 April 2018

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KEYWORDS

Reticles

Semiconductors

Sensors

Microelectronics

Air contamination

Manufacturing

Semiconductor manufacturing

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