With the rapid development of integrated circuits, the number of electronic components on PCBs has multiplied. The increase in the number of components has led to more factors affecting the stability of PCB, with temperature being one of them. Excessive temperature can lead to functional failure or burnout of electronic components. A hybrid algorithm based on particle swarm optimization and simulated annealing algorithm is proposed to optimize the thermal layout of PCB electronic components. The article analyzes the principle and algorithm improvement process of thermal layout optimization, provides specific optimization cases, and verifies the feasibility of this method through MATLAB simulation experiments.
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