3D nanoprinting of free-form structures enables provides exciting perspectives for hybrid integration of different photonic platforms. In particular, by using 3D printed coupling interfaces active and passive circuit components can be joined for creating chipscale solutions for high-bandwidth photonic computing. I will report recent progress on building photonic tensor core architectures which make use of heterogeneous integration. This way silicon photonic components can be seamlessly merged with active III-V circuits to realize core building blocks for photonic accelerators to machine learning.
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