Laser assisted metallization from deep eutectic solutions is a method that allows metal (Cu, Ni, Ag..) to be deposited locally from a film of deep eutectic solution using picosecond laser radiation. As a result, it is possible to create metals or oxides structures on the surface of almost any dielectric without template. The method allows creating conductive structures on curved surfaces with high resolution. This paper shows the creation of electronic components from copper on the surface of glass. We created RFID tag and other devices with a maximum deposition rate of 18mm/sec to show the opportunities of the method. The results demonstrate the advantages of the method, and the low cost of precursors, the simplicity of the method, and its environmental friendliness make it attractive for further implementation in the industry.
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