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Donald Dussault
at ProSys Inc
SPIE Involvement:
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Publications (1)
Proceedings Article | 17 May 2013 Paper
Control of cavitation density through gas and acoustic uniformity in a proximity megasonic pre-bond cleaning system
D. Dussault, E. Liebscher, F. Fournell, V. Dragoi
Proceedings Volume 8763, 87632Y (2013) https://doi.org/10.1117/12.2018006
KEYWORDS: Particles, Semiconducting wafers, Transducers, Wafer bonding, Acoustics, Cavitation, Process control, Wafer testing, Control systems, Surface finishing
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