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Hailan Song
at Beijing Univ of Posts and Telecommunications
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Author
Publications (1)
Proceedings Article | 3 December 2009 Paper
Low-temperature Si/Si wafer bonding using boride-treated surface
Proceedings Volume 7631, 76312I (2009) https://doi.org/10.1117/12.851765
KEYWORDS: Wafer bonding, Semiconducting wafers, Silicon, Interfaces, Annealing, Scanning electron microscopy, Wafer-level optics, Surface finishing, Diffusion, Telecommunications
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