Mr. Jay Wu Profile

Jay Wu

at Jet Propulsion Lab

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Publications (1)

Proceedings Article | 29 August 2022 Presentation + Paper

Packaging design and test of cryogenic readout electronics for the Euclid Near Infrared Spectrophotometer

W. Holmes, H. Aghakians, S. Avasapian, A. Bahraman, A. Berg, A. Beyer, E. Boehmer, R. Calvet, S. Cheung, B. Cho, H. Cho, A. Cillis, L. DelCastillo, M. Dickie, G. Delo, M. Farris, A. Feizi, N. Ferraro, L. Fischer, R. Foltz, N. Hambarsoumian, K. Hong, T. Huang, M. Jhabvala, Er. Kan, R. Kopp, B. Krohn, D. Lewis, M. Loose, K. MacNeal, J. Maiten, D. Markley, G. Maldonado, J. Mehta, J. Melendez, A. Morgan, J. Mulder, M. Ngyuen, N. Ovee, M. Pniel, S. Pravdo, D. Randall, J. Riendeau, A. Runkle, M. Runyan, M. Seiffert, M. Skalare, P. Tan, A. Turner, S. Van Nostrand, A. Waczynski, J. Wu

Proceedings Volume 12191, 121911U (2022) https://doi.org/10.1117/12.2629611

KEYWORDS: Cryogenics, Electronics, Reliability, Aluminum, Silicon, Interfaces, Packaging, Analog electronics, Temperature metrology, Gold

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