Development of high brightness blue lasers that can process copper materials has been increasingly expected to implement a highly efficient processing and downsizing that help to achieve Green Transformation (GX). In order to meet this expectation, the high brightness blue laser oscillator has been developed. Based on the Direct Diode Laser (DDL) method which uses a semiconductor blue laser as a direct light source and our unique Wavelength Beam Combining (WBC) technology, it has achieved 2.1 (kW) of an output power, 3.2 (mm mrad) of Beam Parameter Product (BPP) indicating the beam quality. This laser oscillator can establish a penetration welding of the copper materials with over 2 (mm) in thickness. Development of the pulse power circuit has helped to produce a high current pulse power supply which provides 10 (kHz) of the frequency, 4.8 (μsec) of the rise time, and 0.8 (μsec) of the fall time. Furthermore, the copper plate welding experiment conducted with the pulse power has demonstrated a 3.5-fold higher precision processing compared to the continuous wave driving processing in terms of the aspect ratio which shows the relationship between the welding width and depth.
KEYWORDS: Laser processing, Laser applications, Copper, Laser welding, Reflectivity, Near infrared, High power lasers, Semiconductor lasers, Blue light emitting diodes
High power DDL operating in the 445 nm region are rapidly evolving as one of the preferred laser technologies for welding, cutting, and engraving of highly reflective materials. Until recently, industrial blue laser sources have lacked the beam quality for performing remote processing of materials at the large working distances that are often preferred in many processes. In this paper we will demonstrate laser material processing results obtained with a new generation of industrial blue lasers with BPP of 1.4 mm*mrad. We will present results from remote laser processes including, conduction welding, keyhole welding, and engraving at long working distances.
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