Unspecified Peng Suo Profile

Peng Suo

at Applied Materials South East Asia Pte Ltd

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Publications (1)

Proceedings Article | 9 April 2024 Presentation + Paper

Performance comparison of photosensitive polyimides for high-resolution dual-damascene schemes for FOWLP packaging applications

Luisa Bozano, Roger Quon, Ben Briggs, Ryan Ley, Athena Pang, Peng Suo, Prayudi Lianto, Andy Yong, Arvind Sundarrajan, Jorge Fernandez, Niranjan Khasgiwale, C. C. Chuang, Jang Fung Chen, Siddarth Krishnan, Mike Chudzik, Chris Bencher

Proceedings Volume 12957, 129570X (2024) https://doi.org/10.1117/12.3010203

KEYWORDS: Lithography, Packaging, Polyimides, Materials properties, Electrical properties, Dielectrics, Image processing, Film thickness, Chemical mechanical planarization, Advanced packaging

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