In this paper, we report a high efficiency, addressable 940 nm Vertical-Cavity Surface-Emitting Laser (VCSEL) array with a tight pitch of 10 m for a compact, low-power sensing light source. High electrical resistance of a small diameter semiconductor DBR is a major issue to obtain a high-power conversion efficiency in achieving a tight pitch VCSEL array. We have developed a highly efficient back side emitted VCSEL with intracavity contacted structure, mesa diameter of 7.5 μm, and optical aperture of 3.0 μm. The power conversion efficiency exceeded 30% from 0.5 mW to 3.5 mW in the wide power range. We also report Tx module using this highly efficient VCSEL with a tight pitch of 10 μm. The tight pitch addressable 2D VCSEL array required sophisticated process techniques because they have a small spacing of 2–3 μm between mesas. To improve productivity, we developed a new device structure decreasing the process difficulty between mesas and demonstrated 2D addressable VCSEL array arranged 64 by 64 matrix and 4096 emitters. In addition, we demonstrated addressable operation with assembled sample using Si interposer.
We fabricated a high output power large-scale 2D addressable VCSEL array and demonstrated a small footprint transmitter (Tx) module for true solid-state LiDAR. The module integrated VCSEL array and laser diode driver built-in circuit board in three dimensions. Each used VCSEL had five junctions, large optical aperture, and bump for individual driving. The wavelength of light output through a substrate was 940 nm. VCSELs were arranged in 48×48 matrix wherein 2,304 emitters can be individually driven. The array chip was assembled on the circuit board by flip-chip bonding via bump. All VCSELs were connected to the driver with very short current path caused by the three-dimensional integration. Short current path and small current loop resulted in small resistance and inductance, which facilitated driving of VCSELs with short current pulse. The transmitter module can generate high peak power with short pulse duration for time-of-flight measurement without RF input. Each VCSEL can be sequentially driven by trigger pulse input. The footprint of the module was 17.3 mm square. We confirmed that all VCSELs emit with sequential driving mode; the peak output power was over 45 W and pulse width was approximately 4 ns. The pulse shapes and widths were nearly identical at the center and edge of the array, which is generally unusual for a Tx module with two-dimensional integration where VCSEL and laser driver are integrated side by side. The divergence of output was less than 10°.
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