We released a novel Near-Packaged Optics (NPO) module for short reach interconnect using silicon photonics devices. The module has high-speed signal lanes up to 32 Gbps x 16 lanes with PCIe Gen 5 support. It also has a very small module size of 13 cm2 and a low power consumption of about 9 W. In addition, the module is compliance with Telcordia-GR-468-CORE. The electrical and optical interfaces are a board-to-board mezzanine connector and a multi-mode fiber array, respectively. By using multi-mode fibers, we were able to achieve error-free transmission up to 30 m and reduce mounting costs by passive alignment.
Optical lines using polymer materials fabricated on an organic substrate with metal lines and pads are proposed to realize
fully optical interconnections among high performance LSIs. This optical line enable transmit high speed optical signals
not only on a plane surface but to vertical direction. It has following four particular portions; (1) Curved parallel optical
waveguide; (2) 45 degree reflection mirror; (3) Optical via hole with coaxial structure; (4) Optical joint between package
and board. The optical line characterized by transmission loss and passed through eye diagram, and good optical signal
transmission is confirmed to really use for optical interconnection between LSIs. Then on-board optical signal transmission is demonstrated by that VCSEL and PIN-PD are assembled using flip-chip technology on a circuit board with other electric devices of driving circuit, and also package-to-board optical joint are demonstrated by passing through solder reflow process.
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