Mr. Thorsten Giese Profile

Thorsten Giese

at Fraunhofer ISIT

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Author

Publications (5)

Proceedings Article | 28 March 2021 Presentation + Paper

Laser beam scanning based AR-display applying resonant 2D MEMS mirrors

Oleg Petrak, Fabian Schwarz, Leon Pohl, Marcel Reher, Christian Janicke, Jan Przytarski, Frank Senger, Jörg Albers, Thorsten Giese, Lars Ratzmann, Peter Blicharski, Stephan Marauska, Thomas von Wantoch, Ulrich Hofmann

Proceedings Volume 11765, 1176503 (2021) https://doi.org/10.1117/12.2579695

KEYWORDS: Microelectromechanical systems, Mirrors, RGB color model, Projection systems, Laser sources, Control systems, Waveguides, Virtual reality, Video, Prototyping

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Proceedings Article | 28 February 2020 Presentation + Paper

A bi-axial vacuum-packaged piezoelectric MEMS mirror for smart headlights

F. Senger, J. Albers, U. Hofmann, G. Piechotta, T. Giese, F. Heinrich, T. von Wantoch, S. Gu-Stoppel

Proceedings Volume 11293, 1129305 (2020) https://doi.org/10.1117/12.2542802

KEYWORDS: Microelectromechanical systems, Mirrors, Semiconducting wafers, Wafer bonding, Actuators, Aluminum nitride, Headlamps, Glasses, Silicon, Molybdenum

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Proceedings Article | 22 May 2015 Paper

2D MEMS scanning LIDAR with sub-Nyquist sampling, set-up and functionality

Joachim Janes, Thorsten Giese

Proceedings Volume 9495, 94950S (2015) https://doi.org/10.1117/12.2175855

KEYWORDS: LIDAR, Scanners, Microelectromechanical systems, Avalanche photodetectors, Laser scanners, 3D scanning, Mirrors, Sensors, Analog electronics, Solids

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Proceedings Article | 22 May 2015 Paper

2D MEMS scanning for LIDAR with sub-Nyquist sampling, electronics, and measurement procedure

Thorsten Giese, Joachim Janes

Proceedings Volume 9495, 94950F (2015) https://doi.org/10.1117/12.2175851

KEYWORDS: LIDAR, Electronics, Microelectromechanical systems, Scanners, Modulation, Laser scanners, 3D scanning, Signal detection, Analog electronics, Solids

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Proceedings Article | 14 February 2011 Paper

MEMS scanning laser projection based on high-Q vacuum packaged 2D-resonators

U. Hofmann, C. Eisermann, H.-J. Quenzer, J. Janes, C. Schroeder, O. Schwarzelbach, B. Jensen, L. Ratzmann, T. Giese, F. Senger, J. Hagge, M. Weiss, B. Wagner, W. Benecke

Proceedings Volume 7930, 79300R (2011) https://doi.org/10.1117/12.878676

KEYWORDS: Mirrors, Microelectromechanical systems, Semiconducting wafers, Glasses, Scanners, Silicon, Wafer bonding, Packaging, Electrodes

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