As the third-generation wide band gap semiconductor material, single crystal silicon carbide has high electron saturation mobility and excellent thermal properties. It has broad application prospects in the manufacture of high temperature and radiation resistant high frequency and high-power devices. Magnetorheological polishing of silicon carbide wafers has the characteristics of high efficiency and non-destructive processing, but there is a lack of research on magnetorheological polishing of Si and C surfaces at this stage. Therefore, this paper studies the following aspects. Firstly, through the removal function experiment of multi-parameter comparison, the difference between the residence time of magnetorheological polishing and the removal effect of SiC Si and C surfaces is analyzed, and the efficiency evolution law of magnetorheological polishing of different crystal surfaces is obtained. The influence of different immersion depth of polishing ribbon on the removal efficiency of different crystal faces was explored, and the relationship between polishing depth and material removal rate under different crystal faces was obtained. The results show that with the increase of residence time, the removal efficiency of Si and C surfaces increases, and the growth rate of Si surface is much larger than that of C surface. With the increase of immersion depth, the growth rate of material removal efficiency of C surface is more sensitive than that of Si surface. Therefore, this study explores the technical feasibility of magnetorheological polishing of SiC, and provides a new idea for high-efficiency and high-precision polishing of SiC.
The main factor affecting the laser damage resistance of optical components is the damage precursor introduced in the manufacturing process. Some studies have shown that the ideal intrinsic matrix of fused quartz has a laser radiation damage threshold of up to 100J/cm2, but the manufactured optical components are far below this index. Therefore, effectively inhibiting or even eliminating the damage precursor is the key to improve the anti-laser damage performance of optical components. Abrasive Water Jet Polishing (AWJP) technology mainly removes materials through the collision and shear between abrasive particles and the workpiece surface, which has the characteristics of non-damage and non-contact processing. However, due to the small size of Tool Influence Function (TIF) and low efficiency, it is still challenging to achieve widespread application. In this paper, we analyzed the flow field characteristics near the workpiece surface when different nozzle tilt angles were used for processing under two different machining methods: maintaining the jet length unchanged and maintaining the standoff distance unchanged and corrected the pressure distribution. It was found that the changes in pressure distribution and shear stress distribution in the impact zone under different nozzle tilt angle conditions will result in a change in the width of the Gaussian-shaped TIF obtained after nozzle rotation machining. In addition, under the condition of the same nozzle tilt angle, the TIF of Gaussian shape with larger size can be obtained by using the processing method that keeps the standoff distance constant.
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