With the rapid development of lithography technology, the processing width of lithography line is up to 10 nm. The tiny defects on the surface of substrate and particles attached to the surface have a great influence on the quality of lithography, especially the surface plasmons lithography, which requires the gap between the substrate and the mask should be controlled within dozens of nanometers, since the surface defects and particles seriously affect the quality of the surface plasmons lithography. Substrate detection device in foreign countries is costly, and the results detected by optical microscopes and electron microscopes can’t meet the requirements of the current experiment. Therefore, a set of scattering detection device needs to be developed in order to meet the requirement of the defect detection of the substrate surface.
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