Effective tool induced shift (eTIS) for determining the total measurement uncertainty (TMU) in overlay metrology

Hyunsok Kim; Ikhyun Jeong; Baikkyu Hong; Sejung Ham; Dongsu Kim; Dongsuk Lim; Kangmin Lee; Jeongpyo Lee; Minho Jung; Nanglyeom Oh; Dongsub Choi; Hedvi Spielberg; Ohad Bachar

doi:10.1117/12.2670420

27 April 2023 Effective tool induced shift (eTIS) for determining the total measurement uncertainty (TMU) in overlay metrology

Hyunsok Kim, Ikhyun Jeong, Baikkyu Hong, Sejung Ham, Dongsu Kim, Dongsuk Lim, Kangmin Lee, Jeongpyo Lee, Minho Jung, Nanglyeom Oh, Dongsub Choi, Hedvi Spielberg, Ohad Bachar

Author Affiliations +

Proceedings Volume 12496, Metrology, Inspection, and Process Control XXXVII; 124963O (2023) https://doi.org/10.1117/12.2670420
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Conference Poster

Abstract

Total measurement uncertainty (TMU) is a commonly used key performance indicator (KPI) for tool-induced error in metrology systems. Several definitions of TMU are being used today for overlay metrology (OVL), with the leading definition being the root-sum-square (RSS) of three other KPIs: the wafer mean Tool Induces Shift (TIS𝜇), the wafer variability of TIS (TIS3σ), and the OVL measurement reproducibility (OVL precision). A multitude of TIS management methods has been developed and implemented over the years for calibrating out the raw TIS from OVL. With these TIS management methods in place, the use of the raw TISμ and TIS3σ in TMU no longer serves as a good characterization of the total tool-induced error. In this paper, we describe a procedure for evaluating the actual, post-TIS management, OVL Metrology TMU through the introduction of two new wafer level indicators: the effective wafer means TIS (eTISμ), and the effective wafer TIS variability (eTIS3σ).

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Hyunsok Kim, Ikhyun Jeong, Baikkyu Hong, Sejung Ham, Dongsu Kim, Dongsuk Lim, Kangmin Lee, Jeongpyo Lee, Minho Jung, Nanglyeom Oh, Dongsub Choi, Hedvi Spielberg, and Ohad Bachar "Effective tool induced shift (eTIS) for determining the total measurement uncertainty (TMU) in overlay metrology", Proc. SPIE 12496, Metrology, Inspection, and Process Control XXXVII, 124963O (27 April 2023); https://doi.org/10.1117/12.2670420

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