Paper
12 June 2003 Spin-on bottom antireflective coating defect reduction by proper filter selection and process optimization
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Abstract
A design of experiment (DOE) was implemented to show the effects of various point of use filters on the coat process. The DOE takes into account the filter media, pore size, and pumping means, such as dispense pressure, time, and spin speed. The coating was executed on a TEL Mark 8 coat track, with an IDI M450 pump, and PALL 16 stack Falcon filters. A KLA 2112 set at 0.69 μm pixel size was used to scan the wafers to detect and identify the defects. The process found for DUV42P to maintain a low defect coating irrespective of the filter or pore size is a high start pressure, low end pressure, low dispense time, and high dispense speed. The IDI M450 pump has the capability to compensate for bubble type defects by venting the defects out of the filter before the defects are in the dispense line and the variable dispense rate allows the material in the dispense line to slow down at the end of dispense and not create microbubbles in the dispense line or tip. Also the differential pressure sensor will alarm if the pressure differential across the filter increases over a user-determined setpoint. The pleat design allows more surface area in the same footprint to reduce the differential pressure across the filter and transport defects to the vent tube. The correct low defect coating process will maximize the advantage of reducing filter pore size or changing the filter media.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Nickolas L. Brakensiek, Brian Kidd, Michael Mesawich, Don Stevens Jr., and Barry Gotlinsky "Spin-on bottom antireflective coating defect reduction by proper filter selection and process optimization", Proc. SPIE 5039, Advances in Resist Technology and Processing XX, (12 June 2003); https://doi.org/10.1117/12.485101
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KEYWORDS
Coating

Diffractive optical elements

Manufacturing

Thin film coatings

Semiconducting wafers

Bottom antireflective coatings

Chemistry

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