Development of integration technology for optical PCB and electrical PCB

Doo Yeol Cha; Se Jun Cho; Jai Hyuk Lee; Sung Pil Chang

doi:10.1117/12.844663

15 February 2010 Development of integration technology for optical PCB and electrical PCB

Doo Yeol Cha, Se Jun Cho, Jai Hyuk Lee, Sung Pil Chang

Proceedings Volume 7605, Optoelectronic Integrated Circuits XII; 76050U (2010) https://doi.org/10.1117/12.844663
Event: SPIE OPTO, 2010, San Francisco, California, United States

Abstract

As the demands for the higher data transmission capacity and speed as well as higher integration density grow throughout the network, much works have being done in order to integrate the Electrical PCB with Optical PCB. In this paper, among the key technologies to integrate the Electrical PCB with Optical, the technology for getting the via interconnection line with low resistivity using pulse mode electroplating method and bonding technology for high bonding strength with low temperature process are studied. As a result of this study, the measured value of electrical resistivity shows with a range from 20 to 26 mΩ and the PCB bonding technology with high bonding strength is demonstrated with the value of bonding strength from 7 to 8 MPa.

Citation Download Citation

Doo Yeol Cha, Se Jun Cho, Jai Hyuk Lee, and Sung Pil Chang "Development of integration technology for optical PCB and electrical PCB", Proc. SPIE 7605, Optoelectronic Integrated Circuits XII, 76050U (15 February 2010); https://doi.org/10.1117/12.844663

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