Dr. Andrzej J. Przekwas
at CFD Research Corp
SPIE Involvement:
Author
Publications (14)

Proceedings Article | 11 September 2006 Paper
Proceedings Volume 6326, 63261N (2006) https://doi.org/10.1117/12.681384
KEYWORDS: Particles, Biomedical optics, Scattering, Optical spheres, Laser scattering, Microfluidics, Optical manipulation, Mathematical modeling, Optical tweezers, Gaussian beams

Proceedings Article | 6 March 2006 Paper
Zbigniew Sikorski, Michal Furmanczyk, Andrzej Przekwas
Proceedings Volume 6086, 60861Z (2006) https://doi.org/10.1117/12.646329
KEYWORDS: Lung, Signal detection, Sensors, Near infrared spectroscopy, Signal to noise ratio, Blood, Diffusion, Tissue optics, Monte Carlo methods, Chest

Proceedings Article | 9 February 2006 Paper
Zbigniew Sikorski, William Butler, Zhijian Chen, Andrzej Przekwas
Proceedings Volume 6131, 61310D (2006) https://doi.org/10.1117/12.646881
KEYWORDS: Scattering, Microfluidics, Laser scattering, Optical spheres, Biomedical optics, Particles, Spherical lenses, Optical manipulation, Dielectrics, Electromagnetic scattering

Proceedings Article | 25 July 2003 Paper
Brian Riely, J. Jiang Liu, Hongen Shen, Gerard Dang, Wayne Chang, Y. Jiang, Z. Sikorski, T. Czyszanowski, Andrzej Przekwas
Proceedings Volume 4986, (2003) https://doi.org/10.1117/12.482321
KEYWORDS: Vertical cavity surface emitting lasers, Instrument modeling, Data modeling, Performance modeling, Semiconductor lasers, Doping, 3D modeling, Physics, Computer aided design, Quantum wells

Proceedings Article | 10 April 2000 Paper
Zhiqiang Tan, M. Furmanczyk, Marek Turowski, Andrzej Przekwas
Proceedings Volume 4019, (2000) https://doi.org/10.1117/12.382289
KEYWORDS: 3D modeling, Solids, Control systems, Data modeling, Computer aided design, Microsystems, Etching, Data processing, Human-machine interfaces, Microelectromechanical systems

Showing 5 of 14 publications
Conference Committee Involvement (2)
Thermo-mechanical Issues in Packaging and Assembly of MEMS and MOEMS
28 October 2002 | Bruges, Belgium
Design, Test, Integration, and Packaging of MEMS/MOEMS
9 May 2000 | Paris, France
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