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Jinxin Li
at Yangtze Memory Technologies Co Ltd
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Author
Publications (2)
Proceedings Article | 20 March 2019 Paper
Copper interconnect topography simulation in 3D NAND designs
Yang Li, Rick Li, Peng Jiang, Luming Fan, Aman Zheng, Sicong Wang, Guangyi Wang, Zhengfang Liu, Chunshan Du, Ruben Ghulghazaryan, Qijian Wan, Xinyi Hu
Proceedings Volume 10962, 1096210 (2019) https://doi.org/10.1117/12.2515161
KEYWORDS: Chemical mechanical planarization, 3D modeling, Manufacturing, Process modeling, Data modeling, Copper, Semiconducting wafers, Back end of line, Chemical vapor deposition, Design for manufacturability
Proceedings Article | 20 March 2019 Paper
FEOL CMP modeling challenges and solution in 3D NAND
Yang Li, Rick Li, Peng Jiang, Luming Fan, Aman Zheng, Sicong Wang, Guangyi Wang, Chunshan Du, Zhengfang Liu, Ruben Ghulghazaryan, Qijian Wan, Xinyi Hu
Proceedings Volume 10962, 1096211 (2019) https://doi.org/10.1117/12.2515167
KEYWORDS: Chemical mechanical planarization, 3D modeling, Data modeling, Front end of line, Calibration, Polishing, Oxides, Manufacturing, Process modeling, Transmission electron microscopy
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