CONFERENCE PROCEEDINGS
Advanced Search
Maximilian Prechtl
at Univ der Bundeswehr München
SPIE Involvement:
Author
Publications (1)
Proceedings Article | 5 March 2022 Presentation + Paper
Wafer-scale integration of layered 2D materials by adhesive wafer bonding
Arne Quellmalz, Simon Sawallich, Maximilian Prechtl, Oliver Hartwig, Georg Duesberg, Max Lemme, Frank Niklaus, Kristinn Gylfason
Proceedings Volume 12003, 1200304 (2022) https://doi.org/10.1117/12.2605116
KEYWORDS: Graphene, Semiconducting wafers, Adhesives, Molybdenum, Heterojunctions, Wafer bonding, Chemical vapor deposition, Silicon, Raman spectroscopy, Resistance, Optoelectronics integration, Very large scale integration
SIGN IN TO:
  • View contact details
UPDATE YOUR PROFILE
Is this your profile? Update it now.
Sign into your SPIE.org account
Don’t have a profile and want one?
Create an account on SPIE.org
Advertisement
Advertisement
Back to Top