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Dr. Rokhaya Gueye
Process Eng.
SPIE Involvement:
Author
Publications (1)
Proceedings Article | 9 March 2013 Paper
High-temperature compatible 3D-integration processes for a vacuum-sealed CNT-based NEMS
R. Gueye, S. W. Lee, T. Akiyama, D. Briand, C. Roman, C. Hierold, N. de Rooij
Proceedings Volume 8614, 86140H (2013) https://doi.org/10.1117/12.2006216
KEYWORDS: Glasses, Semiconducting wafers, Microelectromechanical systems, Gold, Resonators, Silicon, Electronics, Wafer bonding, Aluminum, Nanoelectromechanical systems
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