Dr. Roy Knechtel
Project Manager/MEMS Process Development at X FAB Semiconductor Foundries AG
SPIE Involvement:
Author
Publications (3)

Proceedings Article | 21 May 2015 Paper
L. Hofmann, S. Dempwolf, D. Reuter, R. Ecke, K. Gottfried, S. Schulz, R. Knechtel, T. Geßner
Proceedings Volume 9517, 951709 (2015) https://doi.org/10.1117/12.2178598
KEYWORDS: Semiconducting wafers, Microelectromechanical systems, Wafer bonding, Glasses, Copper, Etching, CMOS technology, Sensors, Metals, Silicon

Proceedings Article | 19 May 2009 Paper
Proceedings Volume 7362, 73620O (2009) https://doi.org/10.1117/12.821643
KEYWORDS: Reliability, Semiconducting wafers, Glasses, Sensors, Silicon, Wafer bonding, Gyroscopes, Surface micromachining, Microelectromechanical systems, Metals

Proceedings Article | 11 August 2000 Paper
W. Merlijn van Spengen, Ingrid De Wolf, Roy Knechtel
Proceedings Volume 4175, (2000) https://doi.org/10.1117/12.395600
KEYWORDS: Raman spectroscopy, Silicon, Sensors, Semiconducting wafers, Micro raman spectroscopy, Microelectromechanical systems, Phonons, Raman scattering, Light scattering, Crystals

Conference Committee Involvement (4)
Smart Sensors, Actuators, and MEMS VII
4 May 2015 | Barcelona, Spain
Smart Sensors, Actuators, and MEMS VI
24 April 2013 | Grenoble, France
Smart Sensors, Actuators and MEMS
18 April 2011 | Prague, Czech Republic
Smart Sensors, Actuators and MEMS
4 May 2009 | Dresden, Germany
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