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Dr. Ryan M. Hickey
SPIE Involvement:
Author
Publications (5)
Proceedings Article | 22 February 2018 Paper
Application of quantum-dot multi-wavelength lasers and silicon photonic ring resonators to data-center optical interconnects
Proceedings Volume 10537, 105370K (2018) https://doi.org/10.1117/12.2287915
KEYWORDS: Silicon photonics, Quantum dot lasers, Resonators, Optical interconnects, Modulators, Modulation, Optical filters, Wavelength division multiplexing, Quantum dots, Waveguides
Proceedings Article | 6 October 2006 Paper
Fiber alignment analysis of a receiver with integrated MEMS VOA
Chao Wang, Ryan Hickey, Rob Irwin, Ming Li, Zhengxuan Wang
Proceedings Volume 6352, 63521Q (2006) https://doi.org/10.1117/12.688522
KEYWORDS: Signal attenuation, Receivers, Microelectromechanical systems, Optical alignment, Camera shutters, Attenuators, Roads, Integrated optics, Lens design, Tolerancing
Proceedings Article | 7 March 2005 Paper
Integrated MEMS-based variable optical attenuator and 10Gb/s receiver
James Aberson, Pierre Cusin, H. Fettig, Ryan Hickey, James Wylde
Proceedings Volume 5730, (2005) https://doi.org/10.1117/12.592697
KEYWORDS: Microelectromechanical systems, Receivers, Signal attenuation, Semiconducting wafers, Optical amplifiers, Silicon, Reliability, Variable optical attenuators, Optical fibers, Attenuators
Proceedings Article | 22 January 2005 Paper
Reliability of a thermally actuated MEMS VOA for optical component applications
Ryan Hickey, Robert Mallard, James Wylde, Thomas Shepperd, John Panton
Proceedings Volume 5716, (2005) https://doi.org/10.1117/12.590835
KEYWORDS: Signal attenuation, Resistance, Microelectromechanical systems, Actuators, Reliability, Monte Carlo methods, Instrument modeling, Optical components, Receivers, Attenuators
Proceedings Article | 16 January 2003 Paper
Reliability and qualification of an integrated MEMS attenuator for optical component applications
Ryan Hickey, Heiko Fettig, James Wylde, Stephane Legros, Robert Mallard, Heinz Nentwich, Christopher Hart
Proceedings Volume 4980, (2003) https://doi.org/10.1117/12.472728
KEYWORDS: Microelectromechanical systems, Actuators, Reliability, Failure analysis, Resistance, Oxides, Signal attenuation, Attenuators, Optical components, Instrument modeling
Conference Committee Involvement (3)
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V
25 January 2006 | San Jose, California, United States
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV
25 January 2005 | San Jose, California, United States
Reliability, Testing, and Characterization of MEMS/MOEMS III
26 January 2004 | San Jose, California, United States
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