Fine-polishing techniques, such as chemical mechanical polishing treatments, are important techniques in glass substrate manufacturing. However, these techniques may cause microcracks under the surface of glass substrates because they use mechanical friction. We propose a Non-contact thermal Stress-Induced LightScattering Method (N-SILSM) using a heating device for inspecting surfaces to detect polishing-induced microcracks. The N-SILSM can detect microcracks in a product under a fine-polished surface. It is a technique for exposing microcracks by exploiting the change in light-scattering from microcrack tips due to temperature variation-induced stress. Additionally, optical properties change due to temperature variations. However, at manufacturing sites, it is ideal that inspection systems be able to distinguish between microcracks and tiny particles. In this report, we carry out the selective detection of microcracks and tiny particles using a N-SILSM with temperature variation. Experimental results showed that the amount of change in the lightscattering intensity alters the cubic function regardless of the size of the microcracks, and also confirmed that tiny particles show very little change in light-scattering intensity. In addition, the possibility of microcrack size estimation was suggested from the magnitude of the change in light-scattering intensity. From the above results, it has been shown that microcracks and tiny particles can be identified and measured by a N-SILSM utilizing temperature change, and that microcrack size estimation can be based on the change in light-scattering intensity. Thus, it has been suggested that N-SILSM is a useful inspection technique for distinguishing between microcracks and tiny particles.
Fine polishing techniques, such as chemical mechanical polishing (CMP), are important to glass substrate manufacturing. When these techniques involve mechanical interaction in the form of friction between the abrasive and the substrate surface during polishing, latent flaws may form on the product. Fine polishing induced latent flaws in glass substrates may become obvious during a subsequent cleaning process if the glass surface is eroded away by chemical interaction with a cleaning liquid. Thus, latent flaws reduce product yield. A novel technique (the stress-induced light scattering method; SILSM) which was combined with light scattering method and stress effects was proposed for inspecting surface to detect polishing induced latent flaws. This method is able to distinguish between latent flaws and tiny particles on the surface. In this method, an actuator deforms a sample inducing stress effects around the tip of a latent flaw caused by the deformation, which in turn changes the refractive index of the material around the tip of the latent flaw because of the photoelastic effect. A CCD camera detects this changed refractive index as variations in light-scattering intensity. In this study, the changes in reflection coefficients and polarization states after application of stress to a glass substrate were calculated and evaluated qualitatively using Jones matrix-like ellipsometry. As the results, it was shown that change in the polarization states around the tip of latent flaw were evaluated between before and after applied stress, qualitatively.
The fine polishing technique, e.g. Chemical Mechanical Polishing treatment (CMP), is one of the most important techniques in the glass substrate manufacturing. However, mechanical interaction, e.g. friction, occurs between the abrasive and the surface of substrates. Therefore, latent flaws are formed in the surfaces of glass substrates depending on the polishing condition. In the case of the cleaning process of the glass substrate in which the latent flaws existed, latent flaws become obvious because glass surfaces were eaten away by chemical interaction of cleaning liquid. Therefore, latent flaws are the cause of decrease the yield of products. In general, non-destructive inspection techniques, e.g. light scattering method, foreign matter on the surface of glass substrates. Though, it is difficult to detect the latent flaws by these method, because these are closed. The present authors propose a novel inspection technique of latent flaws which occurred by the fine polishing technique, using light scattering method with stress concentration (Stress-Induced Light scattering Method; SILSM). SILSM is possible to classify and separately detect latent flaws and particles on the surfaces. Samples are deformed by the actuator and stress concentrations are occurred around the tip of latent flaws. By photo-elastic effect, the refractive index of around the tip of latent flaws is changed. And then, changed refractive index is detected by cooled CCD camera as the light scattering intensity. In this report, applying SILSM to glass substrates, latent flaws on the surface of glass substrates are detected non-destructively, and the usefulness of SILSM is evaluated as novel inspection technique of latent flaws.
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