Ms. Hayan Park Profile

Hayan Park

at SAMSUNG Electronics Co Ltd

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Publications (1)

Proceedings Article | 27 April 2023 Presentation + Paper

Semiconductor device metrology for detecting defective chip due to high aspect ratio-based structures using hyperspectral imaging and deep learning

Sunhong Jun, Wonjun Choi, DongHoon Kim, Hayan Park, Dongmin Kyeon, Kyounghwan Lee, Yong-Ju Jeon, Chaemin Lee, Kwangchul Kim, Jeongsu Ha, Sungyoon Ryu, Younghoon Son, Yongdeok Jung

Proceedings Volume 12496, 124961F (2023) https://doi.org/10.1117/12.2657062

KEYWORDS: Intelligence systems, Semiconducting wafers, Deep learning, 3D metrology, Hyperspectral imaging, Etching, Metrology, 3D modeling, Imaging spectroscopy, Defect detection

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