Dr. Donghoon Kim Profile

Dr. Donghoon Kim

at Samsung Electronics

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Author

Publications (4)

Proceedings Article | 27 April 2023 Poster + Paper

3D measurement using SEM technology

Younghoon Sohn, JaeHyung Ahn, Inseok Park, Souk Kim, DongHoon Kim

Proceedings Volume 12496, 124963M (2023) https://doi.org/10.1117/12.2657478

KEYWORDS: Single crystal X-ray diffraction, Scanning electron microscopy, Critical dimension metrology, 3D metrology, Electron beams, Semiconducting wafers, Etching, Cadmium, Optical testing, Optical limiting

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Proceedings Article | 27 April 2023 Presentation + Paper

Semiconductor device metrology for detecting defective chip due to high aspect ratio-based structures using hyperspectral imaging and deep learning

Sunhong Jun, Wonjun Choi, DongHoon Kim, Hayan Park, Dongmin Kyeon, Kyounghwan Lee, Yong-Ju Jeon, Chaemin Lee, Kwangchul Kim, Jeongsu Ha, Sungyoon Ryu, Younghoon Son, Yongdeok Jung

Proceedings Volume 12496, 124961F (2023) https://doi.org/10.1117/12.2657062

KEYWORDS: Intelligence systems, Semiconducting wafers, Deep learning, 3D metrology, Hyperspectral imaging, Etching, Metrology, 3D modeling, Imaging spectroscopy, Defect detection

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Proceedings Article | 27 April 2023 Presentation + Paper

Detection of defective areas and hidden weak patterns in the wafer using massive measurement data

DongHoon Kim, Sungyoon Ryu, Sunhong Jun, Heeyoon Han, Wonjun Choi, Yong-Ju Jeon, Hyun Lee, Souk Kim, Younghoon Sohn

Proceedings Volume 12496, 124961Y (2023) https://doi.org/10.1117/12.2657064

KEYWORDS: Semiconducting wafers, Signal detection, Defect detection, Metrology, Signal processing, Semiconductors, Semiconductor manufacturing, Fourier transforms, Fabrication

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Proceedings Article | 26 May 2022 Presentation + Paper

A study on the detection and monitoring of weak areas in wafer using massive 2D and 3D measurement data

Sungyoon Ryu, Dong Hoon Kim, Sunhong Jun, Suho Ryu, JaeHyung Ahn, Hyun Lee, Kwang-Eun Kim, Yusin Yang, Younghoon Sohn

Proceedings Volume 12053, 1205302 (2022) https://doi.org/10.1117/12.2613631

KEYWORDS: Semiconducting wafers, 3D metrology, Inspection, Metrology, Ellipsometry, 3D modeling, Detection and tracking algorithms, Wafer-level optics, Semiconductors, Manufacturing

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